XINKEHUIADVANCED MATERIALSSEMICONDUCTOR HANDLING & PACKAGING
Explore carrier and packaging formats for wafer fabrication, chip assembly, testing and precision-component logistics. Share your process details with Shanghai XINKEHUI for a product-scope and specification review.
Product scope note Product families and technical examples below are summarized from the PDF you supplied. That document describes another company; it is not evidence of XINKEHUI's manufacturing credentials, current inventory, or supply scope. Please confirm each item directly with us.
Discuss a requirement ↗PRODUCT FAMILIES
Choose around the part being protected, how it moves, the environment it enters, and the equipment that must interface with it.
01 / WAFERSHorizontal or vertical carrier formats, flex-frame designs, single-wafer containers and in-plant cassettes. Configuration depends on wafer diameter, frame type, handling method and transport route.
Discuss your wafer format ↗
02 / COMPONENTSPocketed trays for component handling, test, storage and shipment. Material and tray design should match the component outline, ESD target and thermal profile.
Review tray requirements ↗
03 / PRECISION PARTSIndividual cavities organize small dies, bars, optoelectronic devices and other precision components for controlled handling and transport.
Share part dimensions ↗
04 / PACKAGINGLightweight formed packaging for semiconductor, microelectronics, optics and electronics assembly. PET-family and PS sheet options and thicknesses are listed in the reference catalog.
Ask about tray design ↗05 / SPECIALTY CARRIERSFor high-temperature carrier use, wafer transfer, or sensitive small-part storage, confirm the exact material, dimensions, temperature profile, contact surfaces and inspection criteria.
Plan a technical review ↗WHERE THEY FIT
Carrier selection affects more than transit. It shapes how parts are presented, protected and transferred between people, tools and process steps.
Move wafers between clean-process stations with a format matched to diameter, orientation and handling interfaces.
Present packaged ICs in tray formats chosen for pocket geometry, ESD expectations and equipment compatibility.
Keep small, delicate components organized in cavities suited to their footprint and downstream pick-and-place method.
Evaluate formed trays and specialty boxes for lightweight storage, presentation and controlled internal movement.
A BETTER ENQUIRY STARTS WITH CONTEXT
The right packaging format depends on the component, the process and the route between them. Send the information below so the team can assess product fit and confirm scope.
Part & dimensionsWafer diameter, die outline, component height and tolerances.
Process environmentCleanliness, temperature, chemical exposure and handling stage.
Material & ESDPP, engineering polymer, formed sheet, metal or a defined resistance range.
Logistics & quantityPack-out, capacity, destination, annual volume and target timeline.
WHY WORK WITH XINKEHUI
Shanghai Xinkehui New Materials Co., Ltd. is a semiconductor materials supplier. Its public company information describes production bases, established supplier relationships and support for special wafer specifications. For packaging-product enquiries, we apply that materials-focused background to requirement review and sourcing discussions; packaging manufacturing or stock is not implied.
Our company focuses on semiconductor wafers and substrates, so packaging enquiries can be discussed in the context of the material, format and intended process.
Our public product information describes support for special wafer formats and customized requirements. We can clarify packaging dimensions and selection criteria before confirming feasibility.
The company website notes cooperation with multiple domestic suppliers. Any packaging product sourcing, manufacturing role and availability must still be checked for the specific enquiry.
Company background is based on public XINKEHUI website information. No packaging factory capacity, certification, customer reference or packaging-product performance guarantee is claimed.
STRAIGHT ANSWERS
Product fit, materials and supply scope should be established before a packaging design is finalized.
Ask our team directly ↗You can enquire about wafer shippers and cassettes, JEDEC or IC trays, waffle packs and chip trays, metal wafer carriers, vacuum-formed trays, gel boxes, vacuum-release boxes, and related handling components. XINKEHUI will confirm which items it can source or support for your request.
Start with wafer diameter, wafer orientation, quantity per package, shipping or in-plant use, process-tool interface, ESD requirements, and whether the wafer sits in a flex frame. These details help identify a suitable shipper configuration for review.
The reference catalog lists wafer carrier and shipper formats for several sizes, including 4-inch, 6-inch, 8-inch and 12-inch wafers, with some products also listed for 100 mm, 150 mm, 200 mm and 300 mm. Confirm the exact model and current availability before ordering.
A wafer shipper is generally configured to protect wafers during transport or shipment, often with a cover and cushioning or separators. A cassette is commonly used as a reusable carrier for wafer handling and movement between process stations. The appropriate design depends on your process and logistics.
The reference catalog describes antistatic PP and other material options for selected carriers, as well as conductive and ordinary sheet options for some tray products. State your ESD target and measurement method; the exact material, resistance range, and test evidence must be confirmed for the selected item.
Custom sizes and configurations are described for some product families in the reference catalog. Send a drawing or sample, dimensions, material preference, color, ESD and cleanliness requirements, quantity, and intended equipment interface so XINKEHUI can review feasibility and supply scope.
JEDEC and IC trays hold packaged components in pockets for handling, testing, baking, or transport, subject to the selected tray design and material limits. Waffle packs or chip trays hold small dies and precision components in individual cavities to organize and protect them during handling and shipment.
The reference catalog describes aluminum-alloy metal wafer cassettes and cites a 200–400 °C resistance range for a listed metal wafer cassette. This is not a blanket rating for every carrier; confirm the exact product, temperature profile, duration, load, and supporting evidence before use.
Include the product type, wafer or component dimensions, material and ESD requirements, capacity, use environment, cleanliness needs, drawing or reference photo, quantity, destination, and requested delivery window. Also identify any required inspection records or packaging standard.
No. Product families and technical examples on this page are summarized from the reference catalog you supplied and are not evidence that XINKEHUI manufactures or currently stocks each item. Contact XINKEHUI to confirm its role, product scope, specifications, availability, and quotation for your exact enquiry.
START A PRODUCT CONVERSATION
Send a drawing, product photo or short process description. We will use it to clarify product direction and verify the details that matter for your application.
SHANGHAI XINKEHUI
NEW MATERIALS CO., LTD.